cystech electronics corp. spec. no. : c791q8 issued date : 2010.07.16 revised date : 2011.03.21 page no. : 1/7 MTP4403Q8 cystek product specification p-channel enhancement mode power mosfet MTP4403Q8 bv dss -30v r dson(max) 50m i d -6.1a description the MTP4403Q8 is a p-channel enhancement-mode mo sfet, providing the designer with the best combination of fast switching, ruggedized device de sign, low on-resistance and cost effectiveness. the sop-8 package is universally preferred for all commercial-industrial surface mount applications and suited for low voltage applicati ons such as dc/dc converters. features ? r ds(on) =50m @v gs =-10v, i d =-6.1a r ds(on) =61m @v gs =-4.5v, i d =-5a ? simple drive requirement ? low gate charge ? low voltage drive (2.5v) ? low on-resistance ? fast switching speed ? pb-free lead plating package equivalent circuit outline MTP4403Q8 s source d drain g gate sop-8 ordering information device package shipping MTP4403Q8 sop-8 (pb-free lead plating package) 3000 pcs / tape & reel
cystech electronics corp. spec. no. : c791q8 issued date : 2010.07.16 revised date : 2011.03.21 page no. : 2/7 MTP4403Q8 cystek product specification absolute maximum ratings (ta=25 c) parameter symbol limits unit drain-source breakdown voltage v ds -30 v gate-source voltage v gs 12 v continuous drain current (note 1) i d -6.1 a continuous drain current, t a =70 (note 1) i d -5.1 a pulsed drain current (note 2) i dm -60 a total power dissipation (note 1) pd 2.5 w linear derating factor 0.02 w / c operating junction and storage temperature range tj ; tstg -55~+150 c thermal resistance, junction-to-ambient (note 1) rth,j-a 50 c/w note : 1.surface mounted on 1 in2 copper pad of fr-4 board; 125 c/w when mounted on minimum copper pad. 2. pulse width limited by maximum junction temperature. electrical characteristics (tj=25 c, unless otherwise specified) symbol min. typ. max. unit test conditions static bv dss -30 - - v v gs =0, i d =-250 a v gs(th) -0.6 - -1.3 v v ds =v gs , i d =-250 a i gss - - 100 na v gs =12v, v ds =0 - - -1 v ds =-30v, v gs =0 i dss - - -5 a v ds =-24v, v gs =0, tj=55 - - 50 i d =-6.1a, v gs =-10v - - 61 m i d =-5a, v gs =-4.5v *r ds(on) - - 117 i d =-1a, v gs =-2.5v *g fs - 11 - s v ds =-5v, i d =-5a dynamic ciss - 940 - coss - 104 - crss - 73 - pf v ds =-15v, v gs =0, f=1mhz *t d(on) - 7.6 - *t r - 8.6 - *t d(off) - 44.7 - *t f - 16.5 - ns v ds =-15v, v gs =-10v, r g =6 , r d =2.4 *qg - 9.4 - *qgs - 2 - *qgd - 3 - nc v ds =-15v, v gs =-4.5v, i d =-5a source drain diode *v sd - - -1 v v gs =0v, i s =-1a *i s - - -4.2 a *trr - 22.7 - ns *qrr - 15.9 - nc i s =-5a, v gs =0, di/dt=100a/ s *pulse test : pulse width 300 s, duty cycle 2%
cystech electronics corp. spec. no. : c791q8 issued date : 2010.07.16 revised date : 2011.03.21 page no. : 3/7 MTP4403Q8 cystek product specification typical characteristics
cystech electronics corp. spec. no. : c791q8 issued date : 2010.07.16 revised date : 2011.03.21 page no. : 4/7 MTP4403Q8 cystek product specification typical characteristics(cont.)
cystech electronics corp. spec. no. : c791q8 issued date : 2010.07.16 revised date : 2011.03.21 page no. : 5/7 MTP4403Q8 cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c791q8 issued date : 2010.07.16 revised date : 2011.03.21 page no. : 6/7 MTP4403Q8 cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c791q8 issued date : 2010.07.16 revised date : 2011.03.21 page no. : 7/7 MTP4403Q8 cystek product specification sop-8 dimension *: typical inches millimeters inches millimeters dim min. max. min. max. 8-lead sop-8 plastic package cystek packa g e code: q8 marking: top view a b front view f c d e g part a i h j k o m l n right side view part a date code device name 4403sc dim min. max. min. max. a 0.1890 0.2007 4.80 5.10 i 0.0098 ref 0.25 ref b 0.1496 0.1654 3.80 4.20 j 0.0118 0.0354 0.30 0.90 c 0.2283 0.2441 5.80 6.20 k 0.0074 0.0098 0.19 0.25 d 0.0480 0.0519 1.22 1.32 l 0.0145 0.0204 0.37 0.52 e 0.0138 0.0193 0.35 0.49 m 0.0118 0.0197 0.30 0.50 f 0.1472 0.1527 3.74 3.88 n 0.0031 0.0051 0.08 0.13 g 0.0531 0.0689 1.35 1.75 o 0.0000 0.0059 0.00 0.15 h 0.1889 0.2007 4.80 5.10 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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